CategoryElectric & Electronics
iMAPS New England Symposium & Exhibition
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About this event
iMAPS New England – 52nd Symposium & Exhibition (May 12, 2026)
The iMAPS New England 52nd Symposium & Exhibition is scheduled for Tuesday, May 12, 2026 and will be held at The Crowne Plaza, located at 15 Middlesex Canal Park Rd, Woburn, MA 01801, USA.
This event is positioned as the region’s leading annual microelectronics gathering and represents a long-running chapter symposium experience for professionals focused on international microelectronic assembly & packaging activities across the New England ecosystem.
Co-location and event format
The symposium is co-located with the IMAPS Wire Bonding 2026 Workshop at the same venue and is designed to create a shared audience flow between the all-day Tuesday symposium programming and the wire bonding workshop activity spanning Tuesday and Wednesday (May 12–13, 2026).
In addition, the symposium is described as transitioning to a tabletop exhibitor format. This tabletop approach is intended to help mitigate rising event costs while providing a more fluid, accessible way for exhibitors to engage with attendees.
Who the event is for (buyer/attendee context)
The iMAPS New England symposium and exhibition brings together the microelectronics assembly & packaging community and related supply-chain stakeholders. Based on the event’s framing, the most relevant attendee audience is typically made up of professionals who participate in the development, manufacturing, and technical advancement of microelectronic packaging, assembly processes, and wire bonding-related workflows.
Because the event is also co-located with the wire bonding workshop, the day-of programming provides an especially strong connection point for technical discussions, technology sharing, and supplier interactions among companies and organizations that support packaging production and assembly engineering.
Venue, travel, and stay considerations
The symposium and the co-located workshop sessions take place at The Crowne Plaza in Woburn, Massachusetts. For attendees traveling from outside the local area, the event indicates that IMAPS provides a special room rate and room block, with the room block closing on April 15.
Sponsor and exhibitor ecosystem
The event page highlights participation across sponsorship tiers and mentions a 2026 Platinum Sponsor, along with Gold Sponsors, demonstrating a multi-tier industry presence. The symposium also includes an Exhibitor Listing area, with exhibitors registering for tabletop space.
Overall, iMAPS New England – 52nd Symposium & Exhibition is a concentrated, technical, industry-focused microelectronics event on May 12, 2026 in Woburn, MA, strengthened by the co-location with the IMAPS Wire Bonding 2026 Workshop to support high-relevance technical engagement between symposium attendees and wire bonding workshop participants.
Data sheet
iMAPS New England Symposium & Exhibition – Event Attendee & Buyer Profile Analysis
Event Date: May 12, 2026 |
Location: Woburn, Massachusetts, United States |
Event Status: Upcoming |
Research Date: July 6, 2026
Event Overview
| Event Name | iMAPS New England 52nd Symposium & Exhibition |
| Event Date | May 12, 2026 |
| Event Status | Upcoming |
| Venue | Crowne Plaza Boston - Woburn |
| City | Woburn |
| State / Region | Massachusetts |
| Country | United States |
| Organizer | iMAPS New England Chapter / IMAPS New England |
| Official Event Website | imapsne.org |
| Event Type | Chapter symposium, tabletop exhibition, and technical workshop co-location |
| Primary Category | Electric & Electronics |
| Secondary Applicable Categories | Industrial Engineering, Science & Research |
| Audience Reach | Regional with national technical relevance |
| Estimated Attendance / Expected Footfall | Attendance figure not publicly confirmed by the organizer. |
| Attendance Data Reliability | Low for numeric attendance; high for event format, date, venue, and positioning |
| Main Purpose of Event | To bring together the microelectronics assembly and packaging community for technical education, supplier engagement, tabletop exhibiting, and professional networking. |
About the Event
iMAPS New England 52nd Symposium & Exhibition is a specialized microelectronics assembly and packaging event serving the New England technical ecosystem. The 2026 edition is scheduled for May 12, 2026 at the Crowne Plaza Boston - Woburn and is being positioned as the region’s leading annual microelectronics gathering.
The event is especially relevant for companies involved in semiconductor packaging, wire bonding, advanced assembly, materials, manufacturing services, test and reliability, and supply-chain support. Its co-location with the IMAPS Wire Bonding 2026 Workshop increases cross-attendance potential and makes the event valuable for supplier discovery, technical education, and targeted B2B outreach.
1. Who Attends: Buyers / Attendees
| Buyer / Attendee Segment | Typical Organizations | Buying Role or Influence | Relevance to Exhibitors / Suppliers |
|---|---|---|---|
| Engineering and packaging leaders | Semiconductor firms, OSATs, electronics manufacturers, R&D teams | Influence on process selection, materials, tools, and manufacturing methods | Primary audience for technical solutions, bonding systems, materials, and test equipment |
| Procurement and sourcing teams | Electronics OEMs, contract manufacturers, packaging suppliers | Vendor qualification, RFQs, supplier selection, cost negotiation | High-value for suppliers selling equipment, materials, services, and consumables |
| Manufacturing and operations leaders | Production plants, cleanroom operations, assembly and packaging sites | Capex and process improvement decisions | Strong fit for factory automation, inspection, metrology, and production efficiency suppliers |
| R&D and technology innovation teams | Advanced packaging labs, research centers, universities, industrial labs | Specification, prototyping, and technology evaluation | Good audience for novel materials, tools, and process development partners |
| Quality, test, and reliability teams | Semiconductor manufacturers, medical electronics, aerospace electronics | Approval of testing, qualification, and reliability workflows | Important for test equipment, inspection systems, and failure-analysis services |
| Supplier and partner development teams | Prime contractors, OEMs, chip suppliers, contract manufacturers | Partnership screening, strategic supplier onboarding | Useful for companies selling manufacturing services or strategic technologies |
| Industry consultants and association leaders | Engineering consultants, chapter leaders, technical advisors | Influence, referrals, and market education | Valuable for ecosystem visibility and deal introductions |
2. Event Location and Attendee Geographic Origin
| Geographic Area | Likely Attendee Origin | Buyer Concentration | Notes |
|---|---|---|---|
| Woburn / Boston North Shore | Local technical professionals and suppliers | Medium | Venue is accessible to Greater Boston area companies and labs |
| Massachusetts and New England | Core chapter audience, regional engineering community | High | Strong regional concentration due to chapter identity and local industry base |
| Northeastern United States | Traveling buyers, engineers, and technical vendors | High | Includes Connecticut, Rhode Island, New Hampshire, Maine, and upstate New York spillover |
| National U.S. market | Specialists from semiconductor, defense, medical, and manufacturing sectors | Medium | Relevant where company teams operate nationally but have East Coast presence |
| International technical community | Global microelectronics and packaging professionals | Low to Medium | Likely limited but meaningful for niche technical suppliers and partners |
3. Audience Reach
| Reach Level | Assessment | Explanation |
|---|---|---|
| Regional | Primary classification | The event is chapter-led and anchored in New England, with a strong concentration of local and regional technical buyers. |
| National overlay | Secondary reach | The microelectronics and packaging agenda can attract U.S. participants from broader semiconductor, defense, and manufacturing networks. |
4. Sample Buyer Companies and Websites
| Buyer Company / Organization | Buyer Type | Why It Is Relevant | Website | Best Job Titles to Target | Evidence Level |
|---|---|---|---|---|---|
| MRSI Mycronic | Equipment supplier and likely buyer-side technical participant | Officially named 2026 Platinum Sponsor; strong relevance to microelectronics assembly and packaging ecosystem | mycronic.com | VP Engineering, Product Manager, Sales Director, Applications Engineer | Confirmed Sponsor / Exhibitor |
| Analog Devices | Semiconductor manufacturer | Large New England semiconductor presence; likely buyer of packaging, test, and assembly capabilities | analog.com | Procurement Manager, Packaging Engineer, Operations Director, Supplier Quality Manager | Strong Market Fit, Attendance Not Confirmed |
| Raytheon | Defense electronics prime contractor | Potential buyer of advanced packaging, reliability, and electronics manufacturing services | raytheon.com | Subcontracts Manager, Supply Chain Director, Program Manager, Engineering Manager | Strong Market Fit, Attendance Not Confirmed |
| Lockheed Martin | Defense and aerospace prime contractor | Uses high-reliability electronics and may source packaging and test suppliers | lockheedmartin.com | Strategic Sourcing Manager, Supplier Quality Engineer, Program Manager | Strong Market Fit, Attendance Not Confirmed |
| BAE Systems | Defense electronics contractor | Relevant for advanced interconnects, packaging, and assembly services | baesystems.com | Procurement Lead, Engineering Manager, Product Line Manager | Strong Market Fit, Attendance Not Confirmed |
| Northrop Grumman | Defense and aerospace prime contractor | High-reliability electronics and packaging sourcing needs align with event topics | northropgrumman.com | Supplier Manager, Procurement Director, Design Engineering Manager | Strong Market Fit, Attendance Not Confirmed |
| Intel | Semiconductor manufacturer | Advanced packaging and assembly relevance; likely interested in supplier innovations | intel.com | Packaging Technologist, Procurement Manager, Director of Engineering | Strong Market Fit, Attendance Not Confirmed |
| GlobalFoundries | Semiconductor foundry | Potential buyer of packaging ecosystem services, metrology, and test-related solutions | globalfoundries.com | Supply Chain Director, Process Integration Manager, Procurement Manager | Strong Market Fit, Attendance Not Confirmed |
| Amkor Technology | OSAT / outsourced semiconductor assembly and test | Directly aligned with assembly, packaging, bonding, and test workflows | amkor.com | Operations Director, Procurement Manager, Equipment Engineering Manager | Strong Market Fit, Attendance Not Confirmed |
| Micron Technology | Memory and semiconductor manufacturer | Relevant to advanced packaging, quality, and supplier sourcing | micron.com | Category Manager, Supplier Quality Manager, Engineering Director | Strong Market Fit, Attendance Not Confirmed |
| Thermo Fisher Scientific | Life sciences and instrumentation company | Buyer of precision electronics, sensors, and manufacturing support for instrumentation | thermofisher.com | Procurement Manager, Product Development Director, Operations Manager | Strong Market Fit, Attendance Not Confirmed |
| MIT Lincoln Laboratory | Research and advanced systems lab | Technical buyer and influencer for advanced packaging, prototyping, and test | ll.mit.edu | Research Scientist, Program Manager, Procurement Specialist | Strong Market Fit, Attendance Not Confirmed |
| Raytheon BBN Technologies | Advanced R&D and systems engineering | Potential buyer for specialty microelectronics, lab services, and prototyping support | bbn.com | Technical Program Manager, Research Director, Sourcing Manager | Strong Market Fit, Attendance Not Confirmed |
| Northeastern University | Research and education institution | Relevant for student, faculty, and lab engagement in microelectronics research | northeastern.edu | Research Professor, Lab Director, Procurement Officer | Strong Market Fit, Attendance Not Confirmed |
| UMass Lowell | University / research institution | Regional technical research and talent pipeline; likely attendee base for chapter events | uml.edu | Research Faculty, Lab Manager, Grants Manager | Strong Market Fit, Attendance Not Confirmed |
5. Job Profiles, Industries and Event Type
| Priority | Job Title / Function | Department | Seniority Level | Why This Role Matters |
|---|---|---|---|---|
| 1 | Director of Procurement / Strategic Sourcing Manager | Procurement | Director / Manager | Controls supplier selection and sourcing for equipment, materials, and service contracts |
| 2 | Packaging Engineer / Process Engineer | Engineering | Engineer / Senior Engineer | Evaluates technical fit of tools, materials, and assembly methods |
| 3 | Operations Director / Manufacturing Manager | Operations | Director / Manager | Owns production output, equipment performance, and process improvement |
| 4 | Supplier Quality Manager / Quality Director | Quality | Manager / Director | Verifies supplier compliance, reliability, and qualification |
| 5 | R&D Director / Principal Scientist | Research & Development | Director / Principal | Influences technology adoption and prototype partnerships |
| 6 | CTO / VP Engineering | Executive / Engineering | VP / C-Level | Sets technical strategy and approves major supplier relationships |
| 7 | Program Manager / Capture Manager | Program Management / Business Development | Manager / Director | Manages external partners and technical delivery requirements |
| Priority | Apollo Industry | Why It Fits the Event | Best Buyer Use Case |
|---|---|---|---|
| 1 | Semiconductors | Core market for packaging, assembly, and test suppliers | Packaging, process, test, and equipment sourcing |
| 2 | Electrical/Electronic Manufacturing | Strong fit for electronics assembly and manufacturing services | Operations, sourcing, and production support |
| 3 | Mechanical or Industrial Engineering | Relevant to manufacturing process engineering and tooling | Process improvement and automation solutions |
| 4 | Computer Hardware | Hardware manufacturers need advanced packaging and assembly | Component sourcing and manufacturing services |
| 5 | Defense & Space | High-reliability electronics are a major downstream market | Supplier qualification and reliability-driven selling |
| 6 | Medical Devices | Precision electronics and reliability matter in medtech | High-quality assembly, test, and microelectronics components |
| 7 | Research | Labs and research groups participate in technical chapter events | Prototype, lab services, and collaboration opportunities |
| 8 | Aviation & Aerospace | High-reliability electronics buyers often attend microelectronics events | Qualification, packaging, and reliability solutions |
6. Estimated Attendance
| Metric | Figure | Status | Source / Basis | Notes |
|---|---|---|---|---|
| Estimated total footfall | Not publicly confirmed | Confirmed non-disclosed | Official website content does not disclose attendance | No organizer-verified attendance figure located |
| Exhibitor count | Not publicly confirmed | Unconfirmed | Tabletop format noted; exhibitor listing page referenced | Current listing not extracted from the source text provided |
| Buyer count | Not publicly confirmed | Unconfirmed | Derived from event positioning and audience mix | Likely a technical buyer-heavy audience |
| Speaker count | Not publicly confirmed | Unconfirmed | Technical program is referenced | Speaker roster not included in provided source text |
| Sponsor count | 1 named sponsor confirmed; additional gold sponsors referenced without names | Partially confirmed | Official page states Platinum Sponsor and Gold Sponsors | Only one sponsor organization was explicitly named in the provided content |
| Historical attendance | Not publicly confirmed by organizer | Unavailable | No prior-year counts provided in source text | Use attendee list building rather than numerical planning |
7. Key Focus Areas and Buyer Engagement
| Focus Area | Typical Buyer Need | Buyer Engagement Opportunity | Relevant Supplier Offering |
|---|---|---|---|
| Microelectronics packaging | Improved reliability, miniaturization, and performance | Technical demos and process discussions | Packaging equipment, materials, assembly services |
| Wire bonding | Precision interconnect and workshop learning | Workshop co-location supports hands-on engagement | Wire bond tools, consumables, training, and services |
| Test and reliability | Lower failure rates and qualification support | Target quality and reliability leaders with technical proof points | Inspection systems, test equipment, lab services |
| Materials and consumables | Supply continuity and performance consistency | Procurement-focused outreach and sample qualification | Adhesives, substrates, bonding wire, process chemicals |
| Process automation | Throughput, consistency, and labor efficiency | Show ROI on automation and yield gains | Automated assembly, robotics, vision systems |
| Technology education | Skill development and technical awareness | Sponsored sessions, speaking, and knowledge sharing | Training, consulting, and technical enablement |
Lead Quality Assessment
| Factor | Assessment | Explanation |
|---|---|---|
| Buyer relevance | Very High | The audience is closely aligned with technical buyers in microelectronics assembly and packaging. |
| Decision-maker availability | High | Likely mix of engineering leaders, procurement managers, operations heads, and supplier-side decision makers. |
| Data collection potential | Medium | Strong event relevance, but public attendee list and numeric headcount are not confirmed in the source text provided. |
| Apollo targeting potential | Very High | Clear fit for semiconductors, electronics manufacturing, defense, aerospace, and research institutions. |
| Geographic targeting potential | High | Excellent for New England and Northeast U.S. account mapping, with some national reach. |
| Best outreach approach | Technical + procurement-led | Use technical proof points, applications messaging, and meeting-based outreach before the event. |
| Overall lead quality | High | Best suited for niche B2B lead generation in electronics manufacturing and microelectronics supply chains. |
| Best use case | Attendee list building and targeted account prospecting | Useful for sales teams selling equipment, materials, services, test, and engineering solutions. |
| Limitations / risks | Medium | Public disclosure of attendee and exhibitor details is limited in the provided source text; current-year list validation may require direct event access. |
Apollo.io Targeting Recommendation
| Filter Type | Recommended Filters | Purpose |
|---|---|---|
| Apollo industries | Semiconductors; Electrical/Electronic Manufacturing; Mechanical or Industrial Engineering; Computer Hardware; Defense & Space; Medical Devices; Aviation & Aerospace; Research; Higher Education | Aligns target accounts with microelectronics packaging and high-reliability electronics purchasing |
| Departments | Procurement; Engineering; Operations; Quality; R&D; Supply Chain; Program Management | Reaches both buying influencers and technical approvers |
| Seniority | Manager; Director; VP; CXO; Senior Individual Contributor | Balances budget holders with technical decision makers |
| Job titles | Procurement Manager, Strategic Sourcing Manager, Packaging Engineer, Process Engineer, Quality Manager, Operations Director, CTO, VP Engineering, Program Manager, Supplier Quality Manager | Directly matches likely attendee and buyer personas |
| Geography | Massachusetts; New England; Northeastern United States; United States | Prioritizes local attendance and regional account coverage |
| Employee size | 51-200; 201-500; 501-1,000; 1,001-5,000; 5,001+ | Captures both specialized labs and large semiconductor/defense organizations |
| Keywords | microelectronics, advanced packaging, wire bonding, semiconductor packaging, assembly, test, reliability, cleanroom, OSAT, interconnect | Improves account and contact matching for this niche event |
| Company type | Private, public, government-adjacent labs, research institutions, contract manufacturers | Broadens coverage to the full buyer ecosystem |
Suggested Apollo Search Logic: (semiconductor OR microelectronics OR packaging OR wire bonding OR OSAT OR “electrical/electronic manufacturing”) AND (procurement OR sourcing OR engineering OR operations OR quality OR supply chain OR R&D) AND (manager OR director OR VP OR CTO) AND (Massachusetts OR New England OR Northeast)
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Sources & Verification Notes
| Source | Type | What It Verified | Reliability |
|---|---|---|---|
| iMAPS New England – 52nd Symposium & Exhibition official event page | Official organizer source | Event name, date, venue, co-location with IMAPS Wire Bonding 2026 Workshop, tabletop format, sponsor mention | Very High |
| iMAPS New England home page | Official chapter website | Chapter identity, regional positioning, newsletter and event context | High |
| Crowne Plaza brand site | Venue brand reference | Venue type and hotel conference setting | Moderate |
| MRSI Mycronic / Mycronic corporate site | Sponsor organization reference | Validated named sponsor organization from official event text | High |
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