
7th International Conference on VLSI & Embedded Systems (VLSIE 2026)
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About this event
7th International Conference on VLSI & Embedded Systems (VLSIE 2026)
Date: July 16 – 17, 2026
Venue: London, United Kingdom
Event Type: Academic & Industry Conference focused on Very Large Scale Integration (VLSI) and Embedded Systems
Description
The 7th International Conference on VLSI & Embedded Systems (VLSIE 2026) will be held in conjunction with the 13th International Conference on Computer Science, Engineering and Information Technology (CSEIT 2026) in London, United Kingdom, on July 16–17, 2026. This conference serves as a global platform for researchers, engineers, academics, and industry professionals to explore cutting-edge advancements in VLSI design, embedded systems, microelectronics, and related disciplines.
Aligned with the broader CSEIT 2026 mission, VLSIE 2026 aims to foster innovation and collaboration by addressing theoretical foundations, practical challenges, and emerging trends in semiconductor technologies, embedded computing, IoT integration, and system-on-chip (SoC) architectures. The event encourages submissions and participation from both academic institutions and industrial sectors, bridging the gap between theoretical research and real-world applications.
Key areas of focus include but are not limited to:
- Advanced VLSI design and fabrication techniques
- Low-power embedded systems and energy-efficient computing
- Embedded hardware-software co-design methodologies
- Security in embedded and VLSI systems
- Applications in IoT, edge computing, and AI-driven embedded platforms
Registered authors and attendees can participate either in-person or virtually (hybrid format), ensuring global accessibility. The conference will feature technical sessions, keynote speeches from industry leaders, and opportunities for networking among stakeholders in the electronics and computing domains.
VLSIE 2026 is particularly relevant for professionals involved in semiconductor research, embedded system development, hardware architecture, and electronic system design. It provides a unique opportunity to showcase innovations, discuss challenges, and explore collaborative projects that shape the future of microelectronics and embedded technologies.
Data sheet
| Event Name | 7th International Conference on VLSI & Embedded Systems (VLSIE 2026) |
| Event Date | July 16 – 17, 2026 |
| Event Status | Upcoming |
| Venue | Venue not publicly specified in the supplied official content |
| City | London |
| State / Region | England |
| Country | United Kingdom |
| Organizer | Organizer name not clearly stated in the supplied official content |
| Official Event Website | cseit2026.org/vlsie/index |
| Event Type | Academic & Industry Conference |
| Primary Category | IT & Technology |
| Secondary Applicable Categories | Electric & Electronics; Science & Research |
| Audience Reach | Global |
| Estimated Attendance / Expected Footfall | Attendance figure not publicly confirmed by the organizer. |
| Attendance Data Reliability | Low for headcount; event existence, timing, host city, and hybrid format are confirmed from supplied official source content for the co-located CSEIT 2026 conference. |
| Main Purpose of Event | Research presentation, technical knowledge exchange, academia-industry networking, and discussion of innovations in VLSI design, embedded systems, microelectronics, and related computing technologies. |
The 7th International Conference on VLSI & Embedded Systems (VLSIE 2026) is positioned as a specialist conference track within the broader 13th International Conference on Computer Science, Engineering and Information Technology (CSEIT 2026). The supplied official event content confirms that the parent conference is scheduled for July 16–17, 2026 in London, United Kingdom, with hybrid participation available for registered authors. Based on the event title and supplied conference description, VLSIE 2026 is intended to bring together researchers, engineers, academics, and industry professionals working across VLSI design, embedded computing, SoC architectures, low-power systems, and related semiconductor and hardware-software domains.
From a commercial and lead-generation perspective, this is primarily a high-value thought-leadership and technical networking event rather than a mass-market trade show. The strongest engagement opportunities are likely to come from university research groups, semiconductor design engineers, embedded systems developers, R&D teams, EDA/software tool providers, chip design consultancies, and innovation-focused technology companies. It is relevant for partnerships, technical sales, recruitment, research collaboration, and niche B2B outreach, but less suitable for high-volume attendee-list building unless current-year participant directories become available.
| Buyer / Attendee Segment | Typical Organizations | Buying Role or Influence | Relevance to Exhibitors / Suppliers |
|---|---|---|---|
| University researchers and faculty | Universities, engineering schools, microelectronics research labs | Influence specification, evaluation, grant-led procurement, lab tool selection | Relevant for EDA tools, simulation software, FPGA platforms, test equipment, and research partnerships |
| Embedded systems engineers | Electronics manufacturers, OEMs, device makers, engineering consultancies | Technical evaluators and implementation influencers | High relevance for development kits, design services, RTOS platforms, debugging tools, and component sourcing |
| VLSI / ASIC / SoC design teams | Semiconductor companies, fabless design firms, chip startups | Strong influence on architecture, IP, verification, and design tool selection | High relevance for EDA vendors, IP licensors, validation tools, verification and design services |
| R&D and innovation leaders | Technology companies, industrial R&D centers, advanced engineering labs | Budget influence, partnership evaluation, roadmap alignment | Relevant for joint development, prototyping, research commercialization, and technical alliances |
| Product managers for hardware-enabled products | IoT vendors, edge computing firms, robotics and device companies | Translate technical capabilities into product requirements and supplier evaluations | Useful for component ecosystems, embedded modules, design acceleration, and commercialization support |
| Technical consultants and solution architects | Engineering services firms, advisory practices, systems integrators | Recommend vendors and solutions to clients | Good channel partners for design services, integration support, and specialist hardware-software solutions |
| PhD scholars and early-career researchers | Academic institutions and research consortia | Limited direct purchasing power but high technical adoption influence | Relevant for developer adoption, trials, pilots, academic licensing, and talent outreach |
| Industry speakers, practitioners, and technology leaders | Corporate R&D groups, applied engineering teams, specialist vendors | Thought leadership and strategic influence | Relevant for enterprise partnerships, speaker-led introductions, and account-based outreach |
| Geographic Area | Likely Attendee Origin | Buyer Concentration | Notes |
|---|---|---|---|
| Host city | London | High | London is a major hub for universities, engineering consultancies, AI startups, semiconductor-related design activity, and multinational technology offices. |
| Host state / region | England and wider UK | High | Likely draw from universities, engineering departments, and electronics firms across the United Kingdom. |
| Nearby business hubs | Cambridge, Oxford, Bristol, Manchester, Edinburgh | Medium to High | Strong relevance for semiconductor research, embedded systems design, and university-industry collaboration. |
| National reach | United Kingdom-wide | High | The conference format and academic positioning support participation from researchers and companies across the country. |
| International reach | Europe, Asia-Pacific, North America, Middle East | Medium | The official source confirms hybrid participation, which increases cross-border academic and technical attendance potential. |
| Trade corridor relevance | UK–Europe–Asia technology and research networks | Medium | Most relevant for research collaboration, semiconductor design services, and advanced engineering partnerships rather than large procurement delegations. |
| Reach Level | Assessment | Explanation |
|---|---|---|
| Global | Primary classification | International conference format, hybrid participation, and technical research scope support global reach across academia and industry. |
| National | Secondary reach | Likely strong UK participation due to host-country accessibility and London location. |
| Regional | Secondary reach | Europe-based researchers and engineering firms are likely to be well represented, especially through hybrid participation. |
| Buyer Company / Organization | Buyer Type | Why It Is Relevant | Website | Best Job Titles to Target | Evidence Level |
|---|---|---|---|---|---|
| No official current-year buyer, attendee, exhibitor, sponsor, or speaker organization list was publicly verified from the supplied source set. | N/A | This limits confirmed account-level attendee targeting for the 2026 edition. | N/A | N/A | Confirmed limitation |
| Recommendation: use speaker lists, accepted-paper affiliations, program committee organizations, and author institutions once published. | Prospecting method | These are the most reliable near-term sources for institution- and company-level targeting at academic technology conferences. | cseit2026.org | Professor, Research Director, Embedded Systems Engineer, ASIC Engineer, CTO, R&D Manager | Confirmed source pathway |
| Priority | Job Title / Function | Department | Seniority Level | Why This Role Matters |
|---|---|---|---|---|
| 1 | Director of Engineering | Engineering | Director | Controls technical direction and vendor evaluation for hardware and embedded product development. |
| 2 | Embedded Systems Engineer | Engineering / Product Development | Manager / Individual Contributor | Core user of development platforms, modules, software stacks, and debugging tools. |
| 3 | ASIC Design Engineer | Semiconductor Design | Manager / Individual Contributor | Influences toolchain, IP block, verification, and design service requirements. |
| 4 | Hardware Architect | Architecture / R&D | Senior / Director | Sets technical requirements for advanced compute, low-power design, and system integration. |
| 5 | R&D Manager | Research & Development | Manager | Owns pilot budgets, technical partnerships, and evaluation projects. |
| 6 | CTO | Executive | C-Level | High-value target for technology partnerships, IP, strategic tooling, and commercialization discussions. |
| 7 | Professor / Principal Investigator | Academic Research | Senior | Key for academic labs, collaborative research, grants, and reference-driven adoption. |
| 8 | Product Manager, Embedded / Edge Products | Product | Manager / Director | Connects engineering capability with market-ready product requirements and vendor decisions. |
| Priority | Apollo Industry | Why It Fits the Event | Best Buyer Use Case |
|---|---|---|---|
| 1 | Semiconductors | Direct alignment with VLSI, ASIC, SoC, and chip-design themes. | EDA, IP licensing, design verification, chip design services |
| 2 | Electrical/Electronic Manufacturing | Embedded hardware, controllers, and board-level systems are core use cases. | Embedded modules, components, test equipment |
| 3 | Computer Hardware | Strong relevance for device makers, boards, edge hardware, and computing systems. | Hardware architecture, prototyping, component supply |
| 4 | Information Technology & Services | Covers engineering consultancies, R&D contractors, and tech solution providers. | Design consulting, integration, specialist development services |
| 5 | Computer Software | Relevant for design software, firmware tooling, simulation, and verification platforms. | EDA, compilers, testing tools, embedded software ecosystems |
| 6 | Industrial Automation | Embedded and low-power control systems are highly relevant to automation and control environments. | Controller platforms, embedded integration, sensing and edge control |
| 7 | Computer Networking | Relevant where embedded systems connect to edge, IoT, and communications infrastructure. | IoT gateways, networked devices, secure connectivity |
| 8 | Wireless | Embedded and SoC systems often serve wireless devices and communication modules. | RF-enabled embedded platforms, edge connectivity, telecom device development |
| 9 | Research | The conference has strong academic and applied research positioning. | University labs, public-private collaboration, pilot research projects |
| 10 | Higher Education | Universities are likely major contributors and attendees. | Lab equipment, academic licenses, sponsored research, talent partnerships |
| 11 | Consumer Electronics | Embedded systems are foundational to many device categories. | Low-power design, firmware, modules, integration |
| 12 | Aviation & Aerospace | Advanced embedded and hardware reliability use cases often intersect with aerospace systems. | Mission-critical embedded design and validation |
| Metric | Figure | Status | Source / Basis | Notes |
|---|---|---|---|---|
| Estimated total footfall | Attendance figure not publicly confirmed by the organizer. | Not confirmed | No headcount published in supplied official content | No reliable estimate should be stated without organizer evidence. |
| Exhibitor count | Not publicly confirmed | Not confirmed | No exhibitor directory found in supplied source | This appears to be a conference, not a large expo-first event. |
| Buyer count | Not publicly confirmed | Not confirmed | No buyer program or procurement track verified | Best interpreted as a specialist technical audience rather than a formal hosted-buyer event. |
| Speaker count | Not publicly confirmed | Not confirmed | Agenda and speaker roster not provided in supplied source | Program committee and accepted paper affiliations should be monitored. |
| Sponsor count | Not publicly confirmed | Not confirmed | No sponsor list verified | Commercial partner visibility currently limited. |
| Historical attendance | No historical attendance figure verified from supplied sources | Historical data unavailable | No prior-year statistics in source set | Historical / prior-year evidence not available in the provided materials. |
| Focus Area | Typical Buyer Need | Buyer Engagement Opportunity | Relevant Supplier Offering |
|---|---|---|---|
| VLSI design | Advanced design flows, verification, IP integration, low-power optimization | Technical demos, architecture discussions, engineering workshops | EDA tools, design services, verification platforms, semiconductor IP |
| Embedded systems | Firmware development, hardware-software co-design, debugging, board support | Hands-on product evaluation and technical peer networking | Development kits, RTOS, firmware tools, embedded consulting |
| Low-power and energy-efficient computing | Battery life optimization, thermal efficiency, lightweight compute architectures | Use-case-led outreach to edge, mobile, and industrial device teams | Power analysis tools, low-power IP, energy-aware design services |
| Security in embedded and VLSI systems | Hardware trust, secure boot, device protection, validation | Security-focused technical sessions and solution-led consultative selling | Hardware security solutions, secure firmware, testing and compliance services |
| IoT and edge integration | Device connectivity, data handling, compute efficiency at the edge | Cross-functional outreach to embedded, networking, and product teams | Edge modules, wireless connectivity, integration platforms |
| Research collaboration | Academic-industry partnership, sponsored projects, talent pipeline | Co-authorship opportunities, lab collaborations, grant-linked introductions | Research sponsorship, academic licensing, prototype support |
| Factor | Assessment | Explanation |
|---|---|---|
| Buyer relevance | High | Relevant for specialized technology, design, research, and engineering offers tied to semiconductors and embedded systems. |
| Decision-maker availability | Medium | Some senior technical decision-makers are likely present, but many attendees may be researchers or engineers rather than procurement heads. |
| Data collection potential | Low to Medium | Current-year public participant visibility is limited; value improves when accepted papers and speaker affiliations are published. |
| Apollo targeting potential | High | Apollo can effectively target semiconductor, hardware, embedded, higher education, and R&D-driven organizations by title and function. |
| Geographic targeting potential | High | Strong options across UK, Europe, and international research hubs due to the London location and hybrid format. |
| Best outreach approach | Account-based technical outreach | Lead with technical relevance, research themes, design outcomes, and collaboration value rather than generic sales messaging. |
| Overall lead quality | Medium to High | Good fit for specialized B2B engineering offers; weaker for scaled attendee-list monetization without further official participant data. |
| Best use case | Niche lead generation and partnership targeting | Best for highly focused semiconductor, embedded, academic, and R&D outreach campaigns. |
| Limitations / risks | Medium | Limited official attendee visibility; likely lower volume than major commercial expos; many contacts may be technical influencers rather than direct buyers. |
| Filter Type | Recommended Filters | Purpose |
|---|---|---|
| Apollo industries | Semiconductors; Electrical/Electronic Manufacturing; Computer Hardware; Computer Software; Information Technology & Services; Industrial Automation; Research; Higher Education; Consumer Electronics; Wireless; Computer Networking | Focus on likely organizations aligned with VLSI, chip design, embedded engineering, and applied research. |
| Departments | Engineering; Research; Product; Information Technology; Operations; Education | Capture both technical users and organizational decision influencers. |
| Seniority | C-Level; VP; Director; Head; Manager; Senior | Balance strategy owners with implementers and evaluation-stage technical buyers. |
| Job titles | CTO; Director of Engineering; VP Engineering; Embedded Systems Engineer; Firmware Engineer; ASIC Design Engineer; SoC Architect; Hardware Architect; R&D Manager; Research Director; Professor; Principal Investigator; Product Manager Embedded Systems | Prioritize roles with direct technical evaluation or budget influence. |
| Geography | United Kingdom; London; Cambridge; Oxford; Bristol; Manchester; Europe; selected Asia-Pacific research hubs | Align outreach to likely event travel and hybrid participation patterns. |
| Employee size | 11–50; 51–200; 201–500; 501–1,000; 1,001–5,000; 5,001+ | Cover startups, scale-ups, established design houses, and large engineering enterprises. |
| Keywords | VLSI, ASIC, FPGA, SoC, embedded systems, firmware, microelectronics, chip design, verification, RTL, low power design, edge computing, hardware security, EDA | Improve relevance for niche technical audiences within larger firms and universities. |
| Technologies, if relevant | FPGA, ASIC design flow, simulation tools, embedded Linux, RTOS, hardware verification environments | Useful where Apollo technology data or enrichment is available. |
| Revenue range, if relevant | $1M–$10M; $10M–$50M; $50M–$250M; $250M+ | Separate startups and lab-linked spinouts from enterprise engineering buyers. |
| Company type | Private companies; Public companies; Universities; Research institutions | Reflects the mixed academic and commercial attendee profile. |
| Source | Type | What It Verified | Reliability |
|---|---|---|---|
| VLSIE 2026 Official Page | Official event website | Primary official page for the VLSIE conference track; used as the official website reference for this report. | High |
| CSEIT 2026 Official Website | Official organizer/event website | Confirmed July 16–17, 2026; London, United Kingdom; hybrid participation language; broader conference scope and positioning. | High |
| Supplied event description in user brief | User-provided reference text | Used only for contextual description of subject matter relevance such as VLSI, embedded systems, microelectronics, and academia-industry participation. | Medium |
| Verification note | Research limitation | The supplied official source content did not provide a venue name, organizer name, attendee count, buyer program, sponsor list, exhibitor list, or current-year participant directory. | Confirmed limitation |
| Data conflict handling | Methodology note | Where supplied non-official details conflicted with the official website excerpt, the official website content was treated as the primary source of truth. | High |
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